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                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                mini selective soldering machine for SMT, selective soldering machine with warranty, PCB depaneling soldering machine
                              

Waga:	1050 kg	Moc:	10 kW
Woltaż:	220 V/380 V	Strona procesowa PCB:	≥3
Waga PCB:	≤5 kg	Grubość PCB:	1-6 mm
Szybkość transferu PCB:	0,2-10	Wymiary urządzenia:	1435(dł.)1800(szer.)1670(wys.) mm
Górny prześwit PCB:	120 mm	Wypróżnienie do dołu PCB:	60 mm
Wysokość przenośnika taśmowego:	900 ± 20 mm	Regulowany zasięg przenośnika:	50-450 mm
Ciśnienie wlotu powietrza:	0,6	Zużycie azotu:	1,5
Maksymalne zużycie energii:	<12 kW

Waga:	1050 kg
Moc:	10 kW
Woltaż:	220 V/380 V
Strona procesowa PCB:	≥3
Waga PCB:	≤5 kg
Grubość PCB:	1-6 mm
Szybkość transferu PCB:	0,2-10
Wymiary urządzenia:	1435(dł.)1800(szer.)1670(wys.) mm
Górny prześwit PCB:	120 mm
Wypróżnienie do dołu PCB:	60 mm
Wysokość przenośnika taśmowego:	900 ± 20 mm
Regulowany zasięg przenośnika:	50-450 mm
Ciśnienie wlotu powietrza:	0,6
Zużycie azotu:	1,5
Maksymalne zużycie energii:	<12 kW

High Quality Mini Selective Soldering Machine for SMT Production Line

Key Features

Complete welding process in compact machine space with standard spraying, preheating, and welding units
Rotary track design enables PCB loading/unloading from the same side of the machine
Small footprint - significantly shorter than standard SUNFLOW system machines
Real-time welding process monitoring with comprehensive process recording

Technical Specifications

Parameter Category	Parameter Name	Specification
Body Parameters	Device Dimensions	1435(L)1800(W)1670(H)
	Equipment Weight (KG)	1050
	PCB Top Clearance	120
	PCB Bottom Clearance	60
	PCB Process Side	≥3
	Conveyor Belt Height Above Ground	900±20
	PCB Transfer Speed	0.2-10
	PCB Weight (KG)	≤5
	PCB Thickness (including fixture)	1-6
	Adjustable Range of Conveyor Belt	50-450
Conveyor Belt Width Adjustment Method	Electric
PCB Transfer Direction	Left to right
Air Intake Pressure	0.6
Nitrogen Supply	Provided by customer
Nitrogen Inlet Pressure	0.6
Nitrogen Consumption	1.5
Required Nitrogen Purity	>99.999
Voltage	380
Frequency	50/60
Maximum Power Consumption	<12
Maximum Current	<25
Machine Noise	<65
Communication Interface	SMEMA
Welding System	Welding X-axis Maximum Travel	510
	Maximum Travel of Welding Y Axis	450
	Welding Z Axis Maximum Travel	60
	Minimum Nozzle Outer Diameter	5.5
	Nozzle Inner Diameter	2.5-10
	Maximum Crest Height	5
Tin Furnace Capacity	Approx.13kg(Sn63Pb)/ Approx.12kg(lead-free)
Maximum Soldering Temperature	330
Tin Furnace Heating Power	1.15
Preheating System	Preheat Temperature Range	<200
	Heating Power	6
	Heating Method	Hot air
Spray System	Spray X-axis Maximum Travel	510
	Maximum Stroke of Spray Y Axis	450
	Spray Height	60
	Positioning Speed	<200
	Flux Tank Capacity	2

Standard Machine Configuration

Spray module
Preheating module
Welding module (standard machine with inner diameter 6mm nozzle)
Transmission system

Working Principle

After the pre-programmed program of the spray head controls the PCB board to move to the designated position, only the parts that need to be soldered are sprayed with flux. After spraying and preheating, the electromagnetic pump platform drives the electromagnetic pump to move to the required position according to the preset program for welding, and then completes the soldering process.

Fast and Convenient Programming System

Stable and High-Quality Welding Module

Features and Advantages

Stable wave crest formation
Easy nozzle removal and replacement
High quality nozzle (3-month service life)
Small footprint design
Energy efficient operation
Fast line change capability

Using an electromagnetic pump instead of a mechanical pump provides stable wave peaks during operation, eliminates mechanical wear, and minimizes waste production. The welding module incorporates a high-precision motion system to ensure process accuracy, while specialized processes significantly reduce tin bridging phenomena. User experience is enhanced with welding monitoring cameras and automatic wave height detection.

Transmission System - Roller Conveyor Track

The transmission system utilizes roller conveying, which increases welding space and facilitates soldering of components located close to the board edges.

Selective Soldering Process

Transfer PCB board to designated location
Selective spraying, preheating and soldering of PCB according to set procedure
PCB outgoing process completion

High Precision Spray Module

The standard machine features precision drop nozzles imported from Germany with 130μm diameter, ensuring uniform flux application on required welding areas. Minimum spray area is 3mm, saving at least 90% flux compared to traditional spray methods. For applications requiring less precision, alternative spray nozzles are available for faster spray processes.

All module movements are driven by servo motors and ball screws, ensuring smooth and stable operation with repeatability reaching 0.05mm.

Basic Structure Module

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High Quality Mini Selective Soldering Machine for SMT Production Line

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