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                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                High speed hot bar soldering machine, PCB bonding soldering machine, FPC board soldering machine
                              

Waga:	110 kg	Moc:	10 kW
Woltaż:	220 V/380 V	Model:	YSPC-1A
Obszar roboczy:	200*260mm	Siła wiązania:	3900 N
Możliwość pitchu:	0,25 mm	Podstawowe komponenty:	PLC, skrzynia biegów, silnik, pompa
Kontrola temperatury:	PID w zamkniętej pętli	Kontrola ciśnienia:	Programowalne cyfrowe
Czas cyklu:	Niezwykle krótki	Typ termody:	Ruchomy
System wyrównywania:	Mikrometr/próżnia	Opcjonalna matryca CCD:	Rama, aparat, obiektyw
Typ kontrolera:	na bazie mikroprocesora

Waga:	110 kg
Moc:	10 kW
Woltaż:	220 V/380 V
Model:	YSPC-1A
Obszar roboczy:	200*260mm
Siła wiązania:	3900 N
Możliwość pitchu:	0,25 mm
Podstawowe komponenty:	PLC, skrzynia biegów, silnik, pompa
Kontrola temperatury:	PID w zamkniętej pętli
Kontrola ciśnienia:	Programowalne cyfrowe
Czas cyklu:	Niezwykle krótki
Typ termody:	Ruchomy
System wyrównywania:	Mikrometr/próżnia
Opcjonalna matryca CCD:	Rama, aparat, obiektyw
Typ kontrolera:	na bazie mikroprocesora

High Speed Hot Bar Soldering Machine Bonding PCB and Fpc Board

High Speed Hot Bar Soldering Machine for PCB and FPC Board Bonding

Advanced hot bar soldering system designed for precision bonding of printed circuit boards and flexible printed circuits with exceptional speed and accuracy.

Technical Details

Microprocessor-based controller provides precise and consistent temperature control
Unique pulsed heat thermos offers uniform temperature distribution with fast heating and cool-down
Flexible programmable profiles for targeted idle, preheat and reflow heating
Floating thermos and digital pressure switch ensure optimal pressure distribution across joints
CCD camera system with magnification lens available for fine-pitch positioning

Key Features

Extremely short cycle time with rotary table design
Product loading and unloading during heat sealing process
High quality heat seal application up to 0.25mm pitch
Pneumatic bonding head provides up to 3,900N force
Digital programmable pressure control with LCD display
Closed loop PID temperature control with visible LED display
Bonding cycle triggered by real-time pressure sensor
Floating Thermode ensures consistent pressure and heat transfer
Precision product fixtures with micrometer alignment and vacuum component fixation
Optional CCD alignment module for fine pitch applications
Full microprocessor logic control

Customer Support Advantages

Engineer overseas training for customers
Prompt technical support services
Rapid complaint handling with 30-minute response time
Reliable manufacturing with 15+ experts each having over six years of experience

Technical Specifications