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                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                CCD automatic PCB depaneling machine, high precision PCB router machine, online PCB depaneling equipment
                              

Waga:	3500 kg	Moc:	10 kW
Woltaż:	220V, 110V	Model:	YASTM-4C
Precyzja:	±20 μm	Długość fali lasera:	355 nm
moc lasera:	10 W	Grubość materiału:	≤1,2 mm
Precyzja platformy:	±2 μm	Obszar roboczy:	600*450 mm
Maksymalna moc:	3KW	Średnica wiązki:	20±5 µm
Temperatura otoczenia:	20 ± 2 ℃	Materiał maszyny:	Marmur
Wymiary:	1480mm1360mm1412mm

Waga:	3500 kg
Moc:	10 kW
Woltaż:	220V, 110V
Model:	YASTM-4C
Precyzja:	±20 μm
Długość fali lasera:	355 nm
moc lasera:	10 W
Grubość materiału:	≤1,2 mm
Precyzja platformy:	±2 μm
Obszar roboczy:	600*450 mm
Maksymalna moc:	3KW
Średnica wiązki:	20±5 µm
Temperatura otoczenia:	20 ± 2 ℃
Materiał maszyny:	Marmur
Wymiary:	1480mm1360mm1412mm

High Precision CCD Automatic Positioning/online Pcb Router Machine

High Precision CCD Automatic Positioning Online PCB Router Machine

Laser PCB Separator with ±20 μm Precision for FR4 PCB Boards

450×430 mm 15W UV PCB Separator / FR4 Board Laser Depaneling Machine with ±20 μm Precision

Advanced Laser Depaneling Technology

Completely software-controlled laser process with adaptable processing parameters and laser paths for varying materials and cutting contours
UV laser cutting eliminates appreciable mechanical or thermal stresses on components
Minimal cutting channel requirement (few µm) enables higher component density on panels
Dual-mode system software separates production and setup processes to reduce operator errors
Integrated vision system with fiducial recognition operates 100% faster than previous versions

YASTM-4C Laser Depanelizer Machine Features

High Precision Positioning: CCD automatic positioning with automatic focusing for fast, accurate operation
User-Friendly Design: Simple interface, easy operation, compact footprint, and rigorous security design
Energy Efficient: Reduced energy consumption for significant cost savings
High Performance: Cost-effective solution with fast cutting speed and stable performance

YASTM-4C Technical Specifications

Parameter	Specification
Technical Parameters	Main body of laser: 1480mm × 1360mm × 1412mm
Power	AC220 V
Laser Type	355 nm
Laser Source	Optowave 10W (US)
Material Thickness	≤1.2 mm
Precision	±20 μm
Platform Precision	±2 μm
Working Area	600 × 450 mm
Maximum Power	3 KW
Vibration Control	CTI (US)
Beam Diameter	20±5 μm
Ambient Temperature	20±2 ℃
Machine Base	Marble